https://j.people.com.cn/n3/2026/1106/c95952-20516457.html

As global infrastructure for AI computing power expands explosively, the heat flux density of semiconductor chips is consistently pushing past the limits that conventional materials can withstand. Traditional heat-dissipation materials long used in the industry—such as copper and silicon—are reaching their physical performance limits, making it increasingly difficult to meet the rapid heat-dissipation requirements of high-power chips. Against this backdrop, diamond, with its exceptional physical properties, has emerged as a crucial breakthrough for addressing these industry challenges.

Diamond’s thermal conductivity is four to five times that of conventional copper, offering far superior heat-dissipation efficiency. Furthermore, its excellent electrical insulation allows it to be placed in direct contact with the core components of a chip without the risk of short circuits. This makes it exceptionally well-suited for the extremely demanding thermal environments of high-performance chips.

Currently, diamond-based thermal management materials have moved beyond small-scale laboratory testing and are now on the cusp of large-scale industrial application. According to a research report by Zhongtai Securities Co., Ltd., the global market for diamond-based heat dissipation sheets for high-performance AI chips is projected to reach 8.7 billion yuan by 2026. It is expected to expand rapidly to 59.2 billion yuan by 2030, representing a compound annual growth rate (CAGR) of over 50%.

Estimates by Huafu Securities Co., Ltd. suggest that the market for diamond-based heat dissipation solutions for AI computing applications could reach between 48 billion and 90 billion yuan by 2030. Furthermore, when accounting for growing demand in sectors such as consumer electronics, new energy vehicles, and industrial applications, the market could potentially reach a scale of 100 billion yuan in the long term.